3Pin KW4-3Z-3 mechanical limit switch for Kingroon KP3S 3D printer, and other RAMPS 1.4 control boards.
Product specifications:
Rated current: 5A 125VDCContact resistance: â‰?0mΩInsulation resistan...
Features1. Mini portable drill set, easy to carry around.2. Suitable for professional use.3. Pen-like design for comfortable grip .4. It's electric tool for polishing efficiently not only your nail...
Phaetus's high-quality silicone socks for Dragonfly BMO/BMS will improve the performance of your hotend and the quality of your prints thanks to the insulation it provides for the heating block.
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Introducing the ultimate solution for maintaining optimum temperature stability while printing with your FDM 3D printers - the Heatbed Thermal Insulation Mat. Specially designed to cater to the nee...
Introducing the BIQU B1 SE PLUS 3D Printer Upgrade, a cutting-edge printer that combines advanced features and superior performance to take your 3D printing experience to a whole new level. With it...
Elevate Your 3D Printing Experience with the BIQU B1
Introducing the BIQU B1 3D Printer TFT35 B1 V3.0 Dual Operation System FDM 3D printer, designed to bring your 3D printing to a new level. With i...
Magnetic flexible steel bed plate for LCD resin 3d printer. Flexible steel plate is easy to bend and clean. The flexible steel plate makes it much easier to remove prints. It avoids damage on the o...
Feature:
Made of high-quality material, safe, healthy, nontoxic, ordorless and environmentally friendly for us to use.
Silicone funnel used to pour resin back into a bottle. Fits all kind of bottle...
Kingroon KP3S Mainboard with Stock Firmware
Microcontroller Unit (MCU):
STM32 F407, GD32 F303, or STM32 F103 (depending on the version)
Features:
16-point manual mesh leveling and 16-point au...
Original J-head hotend kit for Kingroon KP3S 3D printer, Kingroon KP3S Pro 3D printer, Kingroon KP3S Pro S1, and Kingroon KP5L 3D printer.
Product specifications:
Nozzle: 0.4mm MK8 brass nozzle
Pac...
Heatsink Aluminum MK7/MK8 40x40x11mm
This heatsink is applicable in most 3D printers or ICs that needs to be cooled down. It is designed to be the most optimized way to dissipate heat, the fin type...
